|
|
| Capabilities Domestic & Offshore |
Capabilities Domestic
|
Standard Technologies
|
Engineering Review
|
| Number of Layers Flex or Flex Rigid |
14
|
20
|
| Surface Finish |
HAL, Au/Ni, Tin Immersion, Entek
|
Other
|
| Trace Width / Trace Spacing |
.002"/.002" or Greater
|
Less than .002" /.002"
|
| Smallest Drilled Hole Size-Flex |
.004" or Greater
|
Same
|
| Smallest Features for Rout |
.02" x .02"
|
.01" x .01"
|
|
|
Capabilities Offshore O
| Description |
Production
|
Prototype
|
| Number of Layers |
1 to 4
|
4 to 6
|
| Thickness Tolerance |
+/–10%
|
below 8%
|
Trace Width (mils)
– 0.5oz Copper |
3 min
|
2 to 3
|
Trace Width (mils)
– 1.0oz Copper |
3 and above
|
below 3
|
| Trace Width Tolerance |
+/– 10%
|
+/– 0.5mils
|
Smallest Hole Size
– Mech Drilied |
8 mils
|
8 mils
|
| Aspect Ratio – PTH |
8:1
|
10:1
|
| SMT Pitch (mils) |
over 15
|
below 15
|
| Lead Time – 1 to 2 Layers |
3 weeks
|
call
|
| Min. Pad Size – Int. (mils) |
FHS + 12
|
FHS + 10
|
| Min. Pad Size – Pattern Plate. (mils) |
FHS + 16
|
FHS + 8
|
| Min. Soldermask Clearance |
4 mils
|
3 mils
|
| Min. Soldermask Webbing |
4 mils
|
–
|
| Allowable Squeezeout per Side |
2 mils / mil
|
below 1 mils / mil
|
| Hardtool Dimensional Tolerance |
+/– 2 mils
|
below +/– 2 mils
|
| Optical Punching Locational Tolerance |
+/– 2 mils
|
+/– 1 mil
|
|
|
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printed circuits, flex circuits, flexible circuits, flexible printed circuits,
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pcb.
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